See How Multiphysics Simulation Is Used in Research and Development

Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.


View the COMSOL Conference 2023 Collection

Modelling of Melt Cast Cooling and Solidification Processes for Explosives

P. Lamy-Bracq[1] and C. Coulouarn[1]
[1]Nexter Munitions, Tarbes, France

A solidification process of casting explosives in shell is studied in this paper. An enthalpy method approach is used to model the solidification process. Both the thermal and mechanical effects are taken into account. An ALE (Arbitrary Lagrangian-Eulerian) method is used to represent ... Read More

Modeling the Rheology of Liquid Detergents

Vincenzo Guida
R&D Process Design Principal Engineer, Procter & Gamble, Italy

Outline of presentation: Comsol is a very flexible platform, ideal to model rheology modification under flow Analogy with reactive flows allows modeling of both thixotropy and gelation with decent level of accuracy and predictability It is possible, to a certain extent, to use 1D ... Read More

Simulation of a Multilayer Thermal Regulator for an Optical Reference

J.A. Ospina[1] and E. Canuto[1]
[1]Politecnico di Torino, Torino, Italy

The research project under which the COMSOL simulations are performed deals with multilayer and fine thermal control of an optical reference cavity for space applications. The cavity, made of Ultra Low Expansion glass (Corning ULE), must be kept close to the zero expansion temperature of ... Read More

Analysis of Infrared Signature of a Ship Operating in MIR and FIR Bands

A. Pellegrini[1], A. Beucci[1], and F. Costa[1]

[1]ALTRAN Italia, Pisa, Italy

In this paper a methodology for calculating the infrared signature of complex objects is presented. The transient thermal analysis allows us to evaluate the temperature distribution on the investigated object, pointing out which parts tend to be warmer. These temperature values are ... Read More

Phasefield Modeling of Ferroelectric Materials

Marc Kamlah
Head of the Mechanics of Materials Department, Forschungszentrum Karlsruhe, Germany

Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Read More

COMSOL Multiphysics® Version 4

Svante Littmarck
President and CEO, COMSOL

Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology. Read More

Inverse Analysis for Heat Transfer Coefficient Identification

F. Tondini[1], P. Bosetti[1], and S. Bruschi[1]

[1]DIMS, University of Trento, Trento, Italy

The hot stamping of boron steels for producing complex structural components of the car body-in-white is more and more widespread. Optimization of sheet forming technologies at elevated temperatures is still troublesome, since the thermal, mechanical and metallurgical phenomena ... Read More

Oxidation of Metallic Nanoparticles

A. Auge[1], A. Weddemann[1], F. Wittbracht[1], B. Vogel[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Read More

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Read More

Simulation of a Heated Tool System for Jet Electrochemical Machining

M. Hackert[1], G. Meichsner[2], and A. Schubert[1][2]

[1]Chair Micromanufacturing Technology, Faculty of Mechanical Engineering, Chemnitz University of Technology, Chemnitz, Germany
[2]Fraunhofer Institute for Machine Tools and Forming Technology, Chemnitz, Germany

Jet Electrochemical Machining (Jet-ECM) is an unconventional procedure using localized anodic dissolution for micromachining. An increasing of the electrolyte temperature will lead to an increase of the electrical conductivity of the electrolyte by about 30% and to a reduction of the ... Read More