You are invited to join us at COMSOL Day Cambridge for a day of multiphysics modeling training, talks by invited speakers, and the opportunity to exchange ideas with other simulation specialists in the COMSOL community.
View the schedule for minicourse topics and presentation details. Register for free today.
This introductory demonstration will show you the fundamental workflow of the COMSOL Multiphysics® modeling environment. We will cover all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and postprocessing.
Simulation of Adhesive Joining Processes
Advanced adhesive joining processes are inherently multiphysics in nature, involving curing of the adhesive, heat transfer through complex structures, and flow behavior that depends upon the temperature, flow rate, and degree of cure of the adhesive. I will share a model of thermocompression adhesive bonding of a silicon die to a substrate and discuss how simulation can help build an understanding of the interactions between process parameters, adhesive properties, and joint quality.
RF Tissue Ablation with Blood Flow
Radio frequency (RF) tissue ablation is a minimally invasive treatment commonly used to destroy tumors or alleviate tissue blockages. It is also a strongly coupled multiphysics problem. We will present a COMSOL Multiphysics® model that we developed for an RF tissue ablation problem targeting a tissue close to a blood vessel. We modeled the coupled electric and heat transfer fields in the tissue and blood. We accounted for blood flow, blood perfusion in the tissue, and a custom tissue damage model that we implemented as an ordinary differential equation (ODE). We will discuss the challenges in validating this model, including obtaining accurate material properties, boundary conditions, and loads.
Learn how to convert a model into a custom app using the Application Builder, which is included in the COMSOL Multiphysics® software. You can upload your apps to a COMSOL Server™ installation to access and run the apps from anywhere within your organization.
Get a quick overview of using the CFD Module and Heat Transfer Module within the COMSOL® software environment.
Explore the capabilities of COMSOL Multiphysics® for electromagnetics in the static and low-frequency regime with a focus on the AC/DC Module.
Learn the fundamental numerical techniques and underlying algorithms related to linear and nonlinear multiphysics simulations. We will cover the difference between iterative and direct solvers as well as the different study types including stationary, transient, and eigenfrequency analysis.
Learn about modeling high-frequency electromagnetic waves using the RF Module, Wave Optics Module, and Ray Optics Module.
Get a brief overview of using the Structural Mechanics Module and Acoustics Module within the COMSOL® software environment.
Learn to use gradient-based optimization techniques and constraint equations to define and solve problems in shape, parameter, and topology optimization, as well as inverse modeling. The techniques shown are applicable for almost all types of models.
Veryst Engineering, LLC. Dr. Nagi Elabbasi is a principal engineer at Veryst Engineering, LLC, and his main area of expertise is modeling multiphysics systems. Dr. Elabbasi has extensive experience in simulating structural mechanics, CFD, heat transfer, acoustics, and coupled systems, including FSI, conjugate heat transfer, and structural-acoustic coupling. Prior to joining Veryst, he worked for nine years in finite element software development. He holds a PhD in mechanical engineering from the University of Toronto.
Veryst Engineering, LLC. Mark Oliver is a senior engineer at Veryst Engineering, LLC. Dr. Oliver has expertise in the structure and mechanical behavior of engineering materials and has worked extensively in the testing, modeling, and failure analysis of adhesives. He holds a PhD in materials science and engineering from Stanford University. Prior to joining Veryst, Mark worked as a research scientist developing adhesives for the microelectronics industry.