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Editor Contact:
Thure Ralfs
thure@comsol.dk

COMSOL Announces Event Series Focusing on Acoustics Simulation

Three virtual COMSOL Day events will showcase the benefits of multiphysics simulation to industries developing audio and acoustics products.

BURLINGTON, MA (April 20, 2022) — COMSOL, maker of the COMSOL Multiphysics® simulation software, is continuing its global virtual event series with COMSOL Day: Acoustics, to be held in three different time zones, with each event featuring a one-day program focusing on acoustics simulation. Sessions will be hosted online on April 28, May 5, and May 19 by organizers in the USA, Europe, and China, respectively.

The events will bring together engineers and scientists looking to advance simulation-driven product development within acoustics and vibrations — two areas that are growing rapidly thanks to a surge in audio applications. The program will feature keynote speakers from research organizations and the audio and automotive industries. Presentations by COMSOL speakers will cover trends in acoustics simulation, such as how companies can benefit from creating their own simulation apps and using the Model Manager in COMSOL Multiphysics®, along with application-specific demonstrations and interactive Q&A sessions.

An advertisement for COMSOL Day: Acoustics that is split into three columns, showing which days the U.S., Denmark, and China offices will host the event, with each column having a different acoustics model.

Acoustics Presentations on Everything from Microspeakers to Room Acoustics

The increasing demand for high-quality audio in everything from phones to concert halls is putting pressure on device manufacturers to develop and optimize acoustics performance for a great variety of products and applications. Virtually every product or device generating sound or vibrations depends on several coupled physics phenomena to operate: typically, electrical, mechanical, fluid flow, and acoustics phenomena. To accurately predict and optimize the real-world performance of such products with simulation, the underlying model needs to take into account coupled physics phenomena: that is, multiphysics.

COMSOL Day: Acoustics provides an opportunity to see how acoustics industry leaders are addressing development and optimization challenges by turning to multiphysics simulation.

Keynote talks:

  • April 28 (USA)
    • “Design and Optimization of Sonos Smart Speakers Using COMSOL Multiphysics®” by Brizi Brown and Wei Yang, Sonos
    • “Automotive Audio in the Digital Age” by Patrick Dennis, Nissan
  • May 5 (Denmark)
    • “Electroacoustic Metamaterials: Designing New Properties of Acoustic Interfaces Through Active Electroacoustic Resonators” by Hervé Lissek, École polytechnique fédérale de Lausanne (EPFL)
    • “Soundbar Designer: An App(lication) for Coupled Electroacoustics Modeling” by Roberto Magalotti, Bowers & Wilkins
  • May 19 (China)
    • "Car Audio System Design with Multiphysics Simulation" by James Gan, Harman Automotive Electronic System (Suzhou)
    • "Acoustic Optimization in Vehicles Using COMSOL Multiphysics®" by Zhiwen Chen, Tymphany

In addition, each event will include COMSOL presentations on topics such as:

  • News and Trends in Acoustics Simulations
  • Room Acoustics
  • Automotive Acoustics and NVH
  • Microacoustics
  • Ultrasound and Nondestructive Testing
  • Aeroacoustics and Flow-Induced Noise
  • Parameter Estimation and Shape Optimization
  • Solvers and Solving Large Models
  • Loudspeakers

“COMSOL Day: Acoustics offers a great opportunity for anyone involved in acoustics product design to see how the industry is benefiting from the use of multiphysics simulation to optimize customer experience, develop new technologies, and create better products,” comments Thure Ralfs, managing director of COMSOL A/S and event host. ”Attendees will also see in practice what it takes to build a model from start to finish, within a wide range of application areas.”

The COMSOL Day: Acoustics event dates and start times are as follows:

  • April 28 at 11 a.m. EDT (USA)
  • May 5 at 9 a.m. CEST (Denmark)
  • May 19 at 1 p.m. HKT (China)

These events are open to all, and attendance is free of charge.

View COMSOL Day Program Details

Participation from any region at any of the events is welcomed. Please note that the sessions hosted by the COMSOL offices in the USA and Denmark will be conducted in English, while the event hosted by the office in China will be in Chinese.

About COMSOL Days

COMSOL Days are popular online events applicable to people who work in industries and areas where COMSOL Multiphysics® can benefit their modeling and simulation projects. All COMSOL Days cover a wide range of subjects, including how to turn COMSOL models into specialized simulation apps for engineers who do not have a background in modeling.

The events feature 1-day programs with keynote presentations, technical sessions, panel discussions, and more. COMSOL Days will continue throughout 2022 with multiple events held each month.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics® product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electromagnetics, structural, acoustics, fluid flow, heat transfer, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics® simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on COMSOL Compiler™ and COMSOL Server™ to deploy applications to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL has 17 offices worldwide and extends its reach with a network of distributors.

COMSOL, COMSOL Multiphysics, COMSOL Compiler, and COMSOL Server are either registered trademarks or trademarks of COMSOL AB.